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Cleaning agents×ゼストロンジャパン - List of Manufacturers, Suppliers, Companies and Products

Cleaning agents Product List

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Reflow oven spray cleaner VIGON RC 303

Reflow oven spray cleaner VIGON RC 303

Water-based flux cleaner suitable for cleaning chain conveyor claws in reflow ovens. Easy to work with and manage, and it finishes beautifully!

VIGON RC 303 can remove all types of baked-on flux residues from reflow ovens and solder baths. It effectively removes accumulated flux and emissions from substrates. 【Features】 ■ Excellent cleaning performance ■ Residue-free composition ■ Highly safe water-based cleaner ■ Suitable for cleaning applications in reflow ovens, chains, and conveyor claws ■ Ideal as a substitute for IPA *For more details, please refer to the PDF document or feel free to contact us.

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Palette Reflow Furnace Component Cleaning Agent ATRON SP 300

Palette Reflow Furnace Component Cleaning Agent ATRON SP 300

It can reliably remove baked-on flux, with low odor and low running costs!

ATRON SP 300 is a water-based alkaline surfactant developed specifically for removing baked-on flux from reflow furnace components, pallets, and more. 【Features】 ■ Suitable for cleaning adhered flux from pallets and reflow furnace parts ■ Reduction in costs and replacement efforts due to the long lifespan of the liquid, and stabilization of cleaning performance ■ Improvement of the working environment due to low volatility and low odor ■ ATRON SP 300 (diluted product) is non-flammable due to its water-based nature, enhancing work safety ■ Contribution to environmental conservation due to low VOCs *For more details, please refer to the PDF materials or feel free to contact us.

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Metal Mask Back Cleaning Agent VIGON UC 160

Metal Mask Back Cleaning Agent VIGON UC 160

Remove IPA, safe and environmentally friendly! Excellent wettability against non-woven fabric significantly reduces the surrounding area of cream solder.

VIGON UC 160 is a water-based cleaning agent specially designed for use in printers to remove cream solder from metal masks. It has excellent wettability on non-woven fabrics, improving cleaning performance and significantly reducing the residue around the cream solder. As a result, it can suppress solder bridges on the circuit board, leading to reliable printing results. Additionally, it is ideal as a substitute for IPA due to its excellent health and safety properties. 【Features】 ■ Cleaning of the back of metal masks in printers ■ Environmentally friendly and highly safe water-based cleaning ■ No negative impact on paste printability ■ Cost benefits from reduced paper usage ■ Reduced defect rates due to high cleaning performance *For more details, please refer to the PDF document or feel free to contact us.

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Metal mask printing error substrate cleaning agent VIGON SC 202

Metal mask printing error substrate cleaning agent VIGON SC 202

Removes cream solder and SMT bond! As it is a water-based cleaning agent, it has no flash point and offers high safety.

VIGON SC 202 is a water-based cleaning agent that reliably removes cream solder and SMT bond in metal mask cleaning. It is also excellent for cleaning printed circuit boards with printing errors. It is recommended for use with spray cleaning machines and ultrasonic cleaning machines. 【Features】 ■ Effectively removes resin, adhesives, inks, solder paste, and flux residues ■ No flash point due to being a water-based cleaning agent, no explosion-proof specifications required ■ Can clean and rinse with a single solution ■ Free of surfactants ■ Contains no halogen compounds *For more details, please refer to the PDF document or feel free to contact us.

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Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Why was cleaning considered essential? An explanation of the cleaning needs for no-clean solder and other related topics.

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

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Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

Limitations of existing cleaning methods and challenges in difficult cleaning! An explanation of low standoff cleaning and more.

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

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Zestron Japan Co., Ltd. Company Profile

Zestron Japan Co., Ltd. Company Profile

Unique cleaning comprehensive power! Offering a wide range of high-end cleaning process solutions for industrial use.

We provide a wide range of cleaning process solutions for high-end industries such as aerospace, military, automotive, telecommunications, and medical, where reliability is essential. Additionally, leveraging our unique comprehensive cleaning capabilities, we contribute to the entire electronics manufacturing industry for cleaning applications in SMT and semiconductor packaging products. Through our global network, local process engineers offer comprehensive cleaning support to help you achieve your business goals. 【Solutions】 ■ Cleaning Tests ■ Analytical Services ■ Process Services ■ Zestron Academy *For more details, please refer to the PDF materials or feel free to contact us.

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Embracing 5G - Evolution and Challenges of Power Devices - [Document]

Embracing 5G - Evolution and Challenges of Power Devices - [Document]

The digital society is reaching new heights! Featuring the characteristics of power semiconductors required under 5G and the importance of the cleaning process.

This document explains the challenges of flux cleaning in 5G. It highlights the promising outlook of 5G and introduces "power semiconductors," which are essential for the future world. It includes the characteristics of power semiconductors required under 5G, the importance of the "cleaning process," and efforts to address cleaning challenges. We encourage you to read it. 【Contents (partial)】 ■ Introduction ■ Outlook for 5G ■ Characteristics of power semiconductors required under 5G ■ Importance of the "cleaning process" for power semiconductors ■ Efforts to address cleaning challenges in power semiconductors *For more details, please refer to the PDF document or feel free to contact us.

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Is the cleaning effect proven? - Challenges in cleanliness evaluation - [Document]

Is the cleaning effect proven? - Challenges in cleanliness evaluation - [Document]

An era where post-cleaning evaluation is questioned! Publication of effective analytical methods other than visual inspection.

This document explains the evaluation methods for cleanliness after flux cleaning. As for existing mainstream evaluation methods, after passing reliability assessments, actual manufacturing processes determine product defects through appearance inspections using AOI. However, there is a growing trend of defects occurring after product inspections. We introduce the factors contributing to such occurrences and effective analytical methods other than appearance inspections, so please take a moment to read through it. [Contents] ■ An era where post-cleaning evaluation is questioned, just like cleaning technology ■ Diversification of flux residue components ■ Separation and analysis methods for complex components ■ Future prospects and added value of cleaning *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for pallet reflow furnace components - ATRON SP 300

Cleaning agent for pallet reflow furnace components - ATRON SP 300

Low odor with excellent cleaning ability! Enhanced cleaning performance and longer lifespan with device use!

We would like to introduce our reflow furnace component and pallet cleaning agent, 'ATRON SP 300'. With just a 30-minute immersion, the cleaning power makes the pallets clean. The running costs can be reduced by about 20-30%, and with 50L of cleaning solution, you can clean over 10 lines of reflow furnace components or more than 1000 pallets. Additionally, using ultrasonic cleaning will further enhance the cleaning power. 【Features】 ■ Excellent cleaning performance ■ No need for rinsing or special drying ■ Excellent material compatibility ■ Low VOC content and low odor ■ Long lifespan and low cost ■ Manual concentration measurement *For more details, please refer to the PDF document or feel free to contact us.

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Tips for Choosing Cleaning Methods: Types of Flux Cleaning Methods and How to Select Them

Tips for Choosing Cleaning Methods: Types of Flux Cleaning Methods and How to Select Them

The typical methods are spray (shower), ultrasonic, and jet! An explanation of flux cleaning.

In this column, we will introduce one of the key points to consider when examining flux cleaning methods: the types of "cleaning methods" and how to select them. Flux cleaning refers to the removal of flux residues (contaminants) while protecting components such as printed circuit boards, power modules, semiconductor packages, and lead frames. The presence of flux residues can lead to issues such as the occurrence of migration and poor adhesion in molding, making flux cleaning necessary in certain cases. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

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What is substrate cleaning? An explanation from basic knowledge to the latest trends in cleaning challenges.

What is substrate cleaning? An explanation from basic knowledge to the latest trends in cleaning challenges.

We will explain the necessity of substrate cleaning, including the latest issues related to ion residues and the effects of metal salts, as well as the analytical methods.

What is substrate cleaning? Is substrate cleaning unnecessary? We provide a detailed explanation of areas where flux cleaning is necessary, among other topics. In Japan, many cases adopt no-clean paste, but to ensure high reliability, cleaning has become essential. We also address the latest cleaning challenges, such as the impact of ionic residues and metal salts on insulation resistance, in this column. Recommended for those who: * Want to investigate the causes of defects despite cleaning * Want to know the latest cleaning challenges and evaluation criteria * Want to explain and promote substrate cleaning within their company, etc. Please see the related links for more information. * You can view the detailed content of the column from the related links. For more information, feel free to contact us.

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Cleaning Technology for Advanced Electronic Components: Mechanisms and Evaluation Methods for Residual Contamination [Document]

Cleaning Technology for Advanced Electronic Components: Mechanisms and Evaluation Methods for Residual Contamination [Document]

Contamination cleaning with bonding! The nature of "cleaning" that can ensure the performance of advanced electronic components.

This document explains the cleaning and post-cleaning analysis methods for advanced electronic components. Focusing on the contamination cleaning after joining, led by the flux cleaning process, it discusses the nature of "cleaning" that can ensure the performance of advanced electronic components, which are a collection of various technologies, as well as future prospects. Please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ The role of no-clean technology in enhancing functionality ■ Why cases requiring cleaning can occur ■ The challenges of cleaning advanced electronic components ■ Post-cleaning analysis *For more details, please refer to the PDF document or feel free to contact us.

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Cleaning agent for power electronics VIGON PE 305N

Cleaning agent for power electronics VIGON PE 305N

Simultaneous removal of flux and oxide film is possible! Suitable for use in complex power module manufacturing.

"VIGON PE 305N" is a neutral aqueous cleaning agent (MPC) developed for power electronics. It effectively removes flux residues from high-reliability, high-temperature solder pastes and excels in removing copper oxide films. It is suitable for cleaning power modules after soldering (such as die attach and heat sink soldering). 【Features】 ■ Excellent effectiveness in flux removal ■ Suitable for cleaning after sintering ■ Activates copper surfaces without staining ■ Well-suited for use in complex power module manufacturing ■ Does not affect passivation ■ Does not require explosion-proof equipment due to having no flash point *For more details, please refer to the PDF materials or feel free to contact us.

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Flux cleaner VIGON PE180 for power semiconductors and PCBs

Flux cleaner VIGON PE180 for power semiconductors and PCBs

No flash point! Neutral water-based cleaner is also excellent for removing oxide films from copper surfaces.

"VIGON PE 180" is a neutral water-based cleaning agent developed for the removal of flux from power electronics and printed circuit boards using spray equipment. It effectively removes flux and is a product with excellent material compatibility. It is used for flux removal from lead frames, discrete components, power modules, power LEDs, and printed circuit boards. Additionally, it excels in removing oxide films from copper surfaces to improve wire bonding/adhesive bonding in the next process and molding properties. 【Features】 ■ Exhibits excellent effectiveness in flux removal ■ Activates copper surfaces without staining ■ Shows excellent material compatibility due to its neutrality ■ Good rinsability due to MPC composition ■ Does not require explosion-proof equipment as it has no flash point *For more details, please refer to the PDF document or feel free to contact us.

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